Thermal Interfaces for AI Systems: Managing Heat at the Limits of Compute Density Interview
Thermal Interfaces for AI Systems: Managing Heat at the Limits of Compute Density Interview The rapid growth of AI and accelerated computing is driving unprecedented power densities, higher heat flux, and tighter mechanical constraints inside modern systems. As CPUs, GPUs, and accelerators continue to scale, thermal interfaces are no longer an afterthought. They are a key enabler of performance and reliability. In this interview, Fujipoly examines how demand from AI applications is changing expectations for thermal interface materials. We will discuss where thermal resistance actually occurs in AI systems, what performance characteristics matter most for TIMs under high heat flux, and why not all AI platforms can rely on the same thermal interface solutions. Attendees will gain insight into when engineers should be thinking about TIM selection during the design process, how liquid cooling and ad...
