Universo Eletrico (Eletric Universe)

  Powering the Next Generation of Intelligent Defense Rugged Computing, Robotic Control & Edge AI for Mission-Critical Operations ...

  Higher power + greater density = less room for losses As AI datacenter power requirements increase, power supply design has to deliver higher efficiency, greater power density and better thermal performance. At the same time, architectures are evolving from today’s 48 V infrastructure toward higher-voltage distribution. Join Nexperia's live technical webinar on Efficient Power Conversion with PSUs for AI Data Centers, and discover how silicon, SiC and GaN technologies can enable advanced power-conversion topologies for next-generation datacenter designs. ...

  Join Powell Electronics at the 2026 Space Tech Expo in Bremen, Germany November 17-19, 2026 Booth W20 Join Powell Electronics at the 2026 Space Tech Expo to explore our latest interconnect solutions for demanding space applications. Stop by our booth to learn more about our top solutions for space including the Positronic SP Max which combines high power density, rugged construction and blind-mating capability to address challenging connectivity requirements. Discuss your application with our team, see samples, and learn more about our proven space solutions.  Don't forget to pick up a printed SP Max infographic to take the technical highlights back to your engineering team. You can also learn more about Space Solutions from Positronic here . Plan Your Visit To Space Tech Expo 2026 Here Contact Powell Today For More Information! www.powell.com Tol...

  Weekly Update November 13, 2026   NEWS Exclusive—Cadence Debuts Platform For Breaking Fragmented Component Workflows By Jeff Child Cadence’s OrCAD Xplore Design Platform slashes component research time and eliminates disconnected workflows to enable seamless, integrated system development for electronics engineers. Tektronix Unveils Low Cost Scope With 12-Bit ADC and Built-In Bode Plots By Jeff Child The entry-level oscilloscope family targets the expanding overlap of IoT sensing, modern power topologies, and university engineering labs. It’s armed with a new FPGA architecture and a touch interface.     The MIPS R2000: The Stanford RISC That Became the Textbook Pipeline   Better Connections: 4 New Connectors Target Industrial, Auto, and More   TI Adds Agentic AI to CCStudio and Launches a Multiprotocol Industrial Ethernet Module   NXP Unwaps Unified Robotics Platform for Trusted Physical AI Designs CONTENT FROM PARTNERS Nisshinbo NC2650 Powe...