Embedded Intel Solutions Monthly Report: IoT Solutions Strategies, Security in the Connected Car, and more!

Website | News | White Papers | Videos | Events | Blogs | Products | Subscribe | Advertise July 2013 TOP STORY Smarter Ways to Embrace the Internet of Things The Internet of Things (IoT) is transforming not only businesses, but also our lives. The ability of intelligent devices to perceive and respond to the environment around them makes them incredibly valuable for complex decision-making in a broad range of industries.  (more) congatec congatec presents its fastest COM Express module based on 4th Generation Intel® Core™ processors congatec announces the availability of the conga-TS87, a Type 6 COM Express module featuring 4th Generation Intel® Core™ processors. The conga-TS87 offers outstanding performance, featuring improved vector processing, more efficient floating point calculation and amazing graphics without an increase in power consumption. Click here for more HTML5 Is What’s Needed To Rapidly Develop IVI Automotive Apps Is HTML5 the right answer for the rabid consumer’s taste for car tech, while still giving the auto manufacturer the safety and security they’re required to offer by law?  (more) Security in the Connected Car Connected, safe and reliable – this is the vision for the car of the future. To make sure these three requirements can be met, vehicle manufacturers, suppliers of electronic ...  (more) Security Concerns Dominate Smart Energy Discussions Smart energy means many things to many people, but for many of the vendors I talk to, the conversation focuses on security. That's not surprising given that ...  (more) WinSystems Fanless, Compact 1.66GHz Intel® Atom™ SBC Integrates PCI Express and PC/104 WinSystems PXM-C388 provides designers direct I/O expansion for the thousands of PC/104 modules currently available worldwide. It offers the enhanced performance and throughput of stackable PCI Express™ (PCIe) and USB. Its high-performance enables applications for security, industrial control, data acquisition, and machine-to-machine communications in the small, rugged form factor. Click here for more FEATURED NEWS & ANALYSIS congatec presents its fastest COM Express module based on 4th Generation Intel® Core™ processors PC/104-Plus SBC with Intel® Atom™ offers High-Performance and Proven I/O Expansion with -40° to +85°C Temperature Operation Emerson Network Power ATCA Systems Ready for Deep Packet Inspection New Aitech Core i7 Haswell-based 3U VPX SBC Offers Enhanced Graphics/Data Processing Axiomtek's Ultra-Slim 8.4-inch Fanless Touch Panel Computer Adopts Intel® Atom™ Processor N2600 - GOT5840T-832 AAEON Releases the AEC-6401, One of the World's Slimmest Compact Embedded Controllers, Featuring Intel® Atom™ N2600 X-ES Announces 4th Generation Intel® Core™ i7 Processor-based VPX, VME, cPCI, XMC, and COM Express SBCs Emerson Network Power A new free white paper describes the key elements of the next-generation communications platform from Intel®, codename Crystal Forest, which enables a single ATCA blade type to perform both control and packet processing functions at very high speed, and the key requirements for an effective system-level implementation. Click here for more Mouser and Intel® Announce Global Distribution Agreement Intel Aims to "Re-Architect" Datacenters to Meet Demand for New Services Axiomtek Introduces Fanless Slim-type Network Appliance with Intel® Atom™ N2600 and 4 Gigabit LANs for SOHO Users – NA341 New Software from GE Allows Customers to Gain Maximum Benefit from 4th Generation Intel® Core™ i7 Processors DFI ATX Motherboard Based on Intel® C226 Chipset Supports Multiple PCIe Configurations for High Computing Workstation Crank Software Selects GrammaTech to Turn Up Software Quality and Security Axiomtek Announces OPS Compliant Signage Players Powered By Intel® Core™ Processors with TPM 1.2 – OPS871 and OPS871-HM DFI ATX Motherboard Based on Intel® C226 Chipset Supports Multiple PCIe Configurations for High Computing Workstation AUVSI For 39 years, AUVSI's Unmanned Systems has been THE global market place for all things unmanned regardless of the domain. This year 8,000 attendees from over 40 countries will converge on Washington, D.C. for the largest international unmanned systems conference where over 600 exhibitors consume more than 350,000 square feet of exhibit space. Where will you be? Click here for more ARTICLES AND TECH BRIEFS PCI-SIG nificant Changes Brewing in Mobile Of five significant PCI Express announcements made at this week's PCI-SIG Developers Conference, two are aimed at mobile embedded. (more) Can We "Tock"? Intel's 4th Generation Core Haswell Targets Embedded, Big Time "Haswell" was introduced in desktop, mobile versions and embedded versions. The architecture's feature set is a boon to embedded designers. (more) Intel Maintains its ATCA Foothold Experts discuss Intel challengers in high-performance, server-class processors, the move to 100G Ethernet and impact of new standards on ATCA-related markets. (more) Needed: Self-Protecting, Security-Aware Mobile Applications with Anti-Tamper Technology Application providers need to step up and begin building in sufficient security for mobile devices, including vulnerability mitigation, re-evaluation of trust and incorporation of secure authentication channels. (more) Enabling Accurate Glucose Measurement Designing a glucose monitoring device is made easy with an 8-bit, 8051-based Programmable SoC When you go to your local pharmacy, you’ll find glucose measurement strips that, when plugged into (more) The Expanding Threat Landscape of Connected Medical Devices The medical device industry is in the earliest stages of addressing medical device security today, but developers should expect to see many changes over the next several years. (more) conga-TS77 Highest Performance COM Express® Type 6 3rd Generation Intel® Core™ processor-based platform Better transcode HD-HD, HD Video Conferencing Improved Graphics Performance, (more) NEXCOM EBC 310X 3.5" Embedded Board Designed for Harsh Environments NEXCOM's 3.5" board, the EBC 310X, upgrades to support operating temperatures ranging from -40°C to 85°C, and comes with conformal coating for added protection. With a sleek profile of 146mm (more) FROM THE BLOGOSPHERE 3D Printering vs. Semiconductor Parallelization A perceptive engineer challenges the suggestion that an army of 3D printers may one day replace portions of the semiconductor wafer and chip industry. … The Big and Small Come Together at Semicon and Intersolar The recently held Semicon West and Intersolar Conferences in San Francisco were interesting examples of technology extremes. At Semicon, for example, major efforts are underway to define the equipment and fabrication facilities needed to produce chips based on 450 mm diameter wafers, while at the other extreme at Semicon, device and equipment designers were challenging [...] … Intel's Atom Roadmap Makes Smartphone Headway After being blasted by users and pundits over the lack of “low power” in the Atom product line, new architecture and design wins show Intel’s making progress. A 10-second Google search on “Intel AND smartphone” reveals endless pundit comments on … Continue reading → … Dell teases new Precision M3800 Workstation laptop with 3,200x1,800 resolution MORE FROM THE BLOGOSPHERE EMBEDDED INTEL® PRODUCT BRIEFS Introducing 3rd Generation Intel® Core™ i3/i5/i7 Processor and Low Power Dual Core Intel® Atom™ Processor-Based Solutions (IEI Technology USA Corp.) Rugged COM Express® Module with 3rd Generation Intel® Core™ i7 Processor for Small Form Factor Systems (Extreme Engineering Solutions, Inc.) ADLQM67PC - Industry's Only PC/104 2nd Gen Intel® Core™ Quad Platform! (ADL Embedded Solutions Inc.) 3rd Gen Mini-ITX Motherboard with Intel® Q77 Express Chipset – MANO872 (AXIOMTEK) Low-Power Intel® Atom™ Processor N2600/N2800-Based Pico-ITX SBC – PICO831 (AXIOMTEK) EC800 Series Palm-Size Fanless Embedded System for In-Vehicle Application (DFI-ITOX, LLC) ATCA-7370 Dual Intel® Processor-based Xeon® ATCA® server blade (Emerson Embedded Computing) ATCA-7470 Dual Intel® Xeon® Processor-based 40G ATCA® packet processing blade (Emerson Embedded Computing)

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