June 2022 Customer Newsletter

 

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Back to Embedded World!
 

We are in Nuremberg, Germany this week to exhibit at the Embedded World trade show once again. The show runs June 21-23. Here’s a preview of some of the newest products we’ve been working on that are on display in our booth. More in-depth information on these new products will be provided in future communications.

 
JASPER COM Express Carrier
 

Our new Jasper is a 3.5 inch form factor (4.00 x 5.75”) board that works with COM Express Type 6 Compact and Basic modules. It features dual PCIe/USB minicard sockets, M.2 2242/2280 Flash socket, PCIe/104 expansion socket, optional integrate data acquisition, and rugged design with thicker PCB and latching connectors. Jasper is available as a carrier board or as a complete SBC with an 11th generation Core i7 COM (11865MRE) COM Express module. Jasper is designed to work with almost any COM Express type 6 module without requiring BIOS modifications. It is perfect for applications requiring high performance, a high degree of I/O expansion, and long life. Jasper will be available for shipment around August-September 2022.

 

Learn more about Jasper here: https://www.diamondsystems.com/products/jasper

 
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The most popular I/O connectors on Jasper are positioned along the front edge,
supporting direct board-to-board connections for more compact and rugged systems.
 
 
GEODE Quick-Ship Expansion-Ready Rugged Computer System
 

Our new Geode rugged system is tough on the outside and precious on the inside. The enclosure is IP67 rated and designed to withstand MIL-STD-202G shock and vibration levels. A new 80 watt power supply provides isolation plus MIL-STD-461, 704, and 1275 compliance. The inside utilizes our new Jasper COM Express carrier and is available with an 11th generation Core i7 COM (11865MRE) and up to 96GB RAM. Geode features a direct board-to-board (B2B) mating system for its I/O connector board that eliminates most cables. The connector board has built-in expansion connectors enabling easy I/O expansion with minicards and PCIe/104 modules installed on Jasper. The entire system is designed to support rapid, easy customization to reduce NRE charges and delivery leadtimes, plus keep costs and minimum order quantities down by using standard enclosures and cables instead of custom ones. Geode will be available for ordering around September 2022 (depending on the availability of Jasper and customer configuration details).

 

Learn more about Geode here: https://www.diamondsystems.com/products/geode

 
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GEODE rugged mission computer
 
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Internal construction showing B2B connection between Jasper COM carrier and connector board
 
 
EPS-8130 Ethernet Switch Now Shipping!
 

Our highly popular EPS-8100 8-port Ethernet switch in PC/104 form factor was halted due to the unavailability of the power supply components on the board. We redesigned the board and relabeled it EPS-8130 (heat sink version) and EPS-8130-XT (heat spreader version). The replacement board is now shipping. The form and functionality are exactly the same as the original. The only noticeable difference is a slight change in the heat sink shape of EPS-8130. (The heat spreader is the same one used on EPS-8100-XT.) We have a very limited number of EPS-8100 / -XT units available for customers who need time to make a change to the new models. Contact sales for pricing and availability.

 

Visit the EPS-8130 web page here: https://www.diamondsystems.com/products/eps8130

 
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The new EPS-8130 is a direct replacement for the previous EPS-8100.
 
New Company Brochure
 

Our new brochure is now available. Find it at the top of our product overview page: https://www.diamondsystems.com/products/

 

The brochure highlights some of the many industries and applications in which customers use our products. We hope to add yours to our list soon.

 

The team at Diamond Systems

 
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Diamond Systems Corporation
158 Commercial St., Sunnyvale, CA 94086 USA
sales@diamondsystems.com
+1-650-810-2500

© 2001-2022 Diamond Sytems, Corp. All rights reserved. Diamond Systems logo is a trademark of Diamond Systems, Corp.

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