We are pleased to unveil the newest addition to the ZEISS Microscopy portfolio: meet the ZEISS Crossbeam 750 FIB-SEM!
With
the Crossbeam 750, you can reduce rework and improve yield while
delivering highly uniform TEM lamellae and precise FIB cross sections on
the first pass. Live simultaneous SEM imaging during FIB milling has
been extended down to 0.5 kV for ultrafine lamella polishing. This
eliminates milling interruptions, delivering clarity and precision for
advanced semiconductor and materials science analysis. |