LIVE Webinar — Sustainability in Manufacturing and Product Design: Winbond’s Octal NAND and Green Product Portfolio

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Can’t attend the live webinar?  Register and we will send you a link to watch the recording at your convenience.
Overview:

As next-generation applications demand both higher performance and lower energy consumption, memory innovation must evolve beyond performance alone. This webinar will explore how Winbond integrates sustainability into both manufacturing and product design to support ESG goals while meeting the needs of automotive, industrial, and other performance-driven applications.

What you’ll learn: 

Attendees will learn how Winbond advances sustainability through renewable-energy manufacturing, carbon-reduction efforts, and low-footprint product design. The session will also highlight Octal NAND Flash for fast boot and fast OTA update applications, as well as 1.2V NOR Flash for low-power system design.
 

Presented by: 
Will Yu
Winbond Electronics

Will Yu joined Winbond in 2016 and is currently responsible for new product planning, product marketing, and NAND Flash product line management. With over 16 years of experience in the semiconductor industry, he previously served as a Product Application Engineer at Nuvoton Technology and a Project Supervisor at ELAN Microelectronics.

 
Register
Sponsored by:

Winbond Electronics is one of the select few IDM memory companies with its own wafer fabrication plants, manufacturing process technology, and product development teams.

Winbond‘s extensive product portfolio includes Code Storage Flash and TrustME® Secure Flash, alongside Customized Memory Solution (CMS). These products are widely trusted by tier 1 customers across industries such as communications, consumer electronics, automotive, industrial applications, and computer peripherals.

Headquartered in the Taichung city of Taiwan, Winbond operates subsidiaries in the USA, China, Japan, Germany, India, Korea, Hong Kong, Singapore, and Israel. The company also operates two own cutting-edge 12-inch fabrication facilities in Taichung and Kaohsiung. Through these facilities, Winbond continues to drive innovation by developing in-house technologies to deliver top-quality integrated circuit products and services.

Contact: ythsu2@winbond.com

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