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Master Bond EP55TCFL is a thermally conductive, electrically insulating epoxy system developed for bonding, sealing, coating, and small potting applications.
It meets NASA low outgassing specifications and incorporates a filler with small particle sizes, enabling application in thin bond lines to minimize thermal resistance.
The system is 100% reactive, contains no solvents or diluents, and exhibits low shrinkage upon cure.
The material provides a thermal conductivity of 3.2–3.8 W/(m•K) and a volume resistivity greater than 1014ohm-cm at 25°C.
It features a low tensile modulus of 8,000–12,000 psi, an elongation of 10–20%, and a Shore D hardness of 55–65, providing flexibility and thermal cycling capabilities.
EP55TCFL is serviceable over a temperature range of -50°C to +125°C and adheres to substrates including metals, composites, ceramics, and many plastics.
EP55TCFL is available as a two part system or as a one part premixed and frozen system. The two part version has a 100:15 mix ratio by weight,
a mixed viscosity of 30,000–60,000 cps, and a working life of 2–4 hours for a 100-gram batch at 25°C. It cures with elevated temperature schedules of 4–6 hours at 50–70°C or 3–4 hours at 80–90°C.
Packaging options include 1, 4, and 8 ounce jars for the two part formulation, as well as 3 cc, 5 cc, and 10 cc premixed and frozen syringes.
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