Live from SEMICON Europa 2026 - Day Four

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www.semiconductordigest.com
November 13, 2026
Day Four
Confidence for Critical UHP Systems
Semiconductor UHP systems demand connections that help protect purity and performance. Swagelok® VCR® metal gasket face seal fittings deliver dependable sealing for critical gas and fluid systems where cleanliness and reliability matter. See our solutions at Booth C2235. More>>
Top Stories
Almere, Flevoland, and Q.ANT team up for computing with light
German leader in photonic AI chips signs Memorandum of Understanding with Innovally and Horizon Flevoland at SEMICON Europa. More>>
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DUV 248nm UV LED Photolithography Exposure System
The Gas-Free Alternative to KrF Excimer Lasers. UVER builds custom 248nm (KrF), 365nm (i-line), 405nm (h-line) and 435nm (g-line) photolithography systems. Visit UVER at Booth C2.228.  More>>
New Products & Technologies
imec and ASRA release joint architectural requirements for interoperable automotive chiplets
Automotive Chiplet Interoperability Requirement (ACIR) document complements existing standards by establishing a common set of architectural requirements for an open, multi-vendor automotive chiplet ecosystem. More>>
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Teledyne Vision Solutions demonstrates single-pass 300mm wafer inspection
Teledyne Vision Solutions showcases advanced imaging technologies for semiconductor inspection at SEMICON Europa 2026. More>>
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See Beyond Optical Methods: The Full Particle Size Story for CMP Slurries
Discover how aerosolization + SMPS delivers accurate, high-resolution particle size distributions independent of refractive index. Download the application note to explore how better particle data supports slurry characterization, formulation optimization, and more informed planarization process decisions. Visit TSI at Hall B0, Stand 722.  More>>
Research & Business Developments
VTrox reports nearly 200 AI-powered X-ray inspection systems deployed
ViTrox will demonstrate a curated line-up of its flagship AI-driven inspection technologies, spanning front-end SMT assembly through to back-end semiconductor and advanced packaging. More>>
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Shannon Davis
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sdavis@semiconductordigest.com 
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