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Mostrando postagens de agosto, 2024

PI Webinar – Slim and Efficient Automotive µDCDC Converters

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  PI Webinar – Slim and Efficient Automotive µDCDC Converters We invite you to join us for an insightful webinar focused on the complexities of high-voltage power electronics in EV charging applications. Power Integrations’ technical expert will delve into various charging topologies and discuss the impact of increasing charger voltages. We'll also demonstrate how to design µDCDC converters for the next generation of electric vehicle architectures. Key topics include thermal management, efficiency, and optimizing magnetics design. GaN and Planar: Making Automotive µDCDC Converters Slim and Efficient Thursday, September 5, 2024 2:00 PM to 3:00 PM EDT Peter Vaughan – Director of Automotive Business Development Register Today In this webinar, you will learn: How to enable high-power µDCDC solutions Design optimization with ...

Mr. Green's Efficiency Watch - August 2024

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  Mr. Green's Efficiency Watch The quarterly review of energy efficiency standards & regulations August 2024 Mr. Green says… Welcome to a red-hot summer edition of Efficiency Watch. We begin this issue in the City of Light, with a look at the efforts to reduce carbon emissions during the Paris Olympics. We continue our journey in sunny California, answering the question: Should we cover deserts with solar panels? While on a hot streak of good ideas, we examine the increasingly popular concept of converting streetlights to EV charging stations. Then, we discuss the EU’s plan to update energy efficiency evaluation methods for new computers. Finally, we delve into the need for robust gallium nitride (GaN) technology in high-voltage applications. As always, if you have any questions or comments, or would like me to report on a specific regulation, please feel free to contact me through our web form. In th...

Celebrating Inventor H. Joseph Gerber, the Man Behind the File Format

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  Weekly Update August 30, 2024 NEWS Celebrating Inventor H. Joseph Gerber, the Man Behind the File Format By Duane Benson Heinz Joseph Gerber escaped from a Nazi labor camp to become one of the most prolific U.S. inventors of the 20th century. Hot Chips Heavy Hitter: IBM Tackles Generative AI With Two Processors By Jake Hertz Announced this week at Hot Chips 2024, the new processors use a scalable I/O sub-system to slash energy consumption and data center footprint. Japan’s NTT-Docomo Uses Quantum Computing to Optimize Cell Networks By Duane Benson Japan’s leading telecommunications company has partnered with quantum computing company D-Wave to use D-Wave’s equipment for network operational improvement. Qualcomm Serves Up Snapdragon Mobile Platform to Enhance AI Tasks By Aaron Carman Whether it’s on-phone generative AI or AI-enabled feature enhancements, Qualcomm’s new Snapdragon chip brings smart performance to mobile devices. CONTENT FROM PARTNERS Amphenol / SSI MediaGa...