Introduction to Inverse Class F Power Amplifiers
Weekly Update February 28, 2025 NEWS ST Makes Its Foray Into Silicon Photonic ICs for Data Center Interconnects By Jake Hertz With Amazon Web Services as a major partner, STMicroelectronics has launched its first silicon photonics solution. ISSCC: Sony Pushes Global Shutter to Commercial Cameras With Image Sensor By Aaron Carman Thanks to pixel-parallel ADCs, Sony’s new sensor could make global shutter technology commonplace. The company shared details in its ISSCC paper this week. Microsoft Unveils Quantum Computing Chip Using ‘Topoconductor’ Materials By Jake Hertz Leveraging a new state of matter, Microsoft is pushing that state of quantum computing from theoretical to practical. ISSCC 2025: Intel Propels Chiplet Interconnect Speed and Flexibility By Duane Benson The company demonstrated configurable, bandwidth-scalable heterogenous 2.5D interfaces across 20 chiplets from two foundries. CONTENT FROM PARTNERS Online Circuit Simulator Sponsored by Toshiba Let's simpl...