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August OpenVINO Insider: Deploy Muse Glimmer 30B and Qwen 3.8-27B locally on Intel hardware.

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  OpenVINO™ Insider Download Notebooks Documentation DevCon Model Hub Top Picks This Month Start with the latest 2026.3 release, then learn how to run Muse Glimmer and Qwen 3.8-27B locally on Intel® hardware. This month's OpenVINO™ lineup has a lot to unpack — from faster MoE inference and YOLO on Raspberry Pi, to turning AI PCs into mighty assistants, a new HunyuanOCR notebook, and more. OpenVINO™ 2026.3: New Models, New Pipelines, Smarter Inference OpenVINO™ 2026.3 introduces EAGLE‑3 speculative decoding for LLMs and VLMs, FP8 quantization support for ONNX models, lazy weight loading to reduce peak memory usage and more. Local Agentic AI, Unlocked: Muse Glimmer 30B on Intel® Platforms Mus...

Last Chance to Register — AI Meets Capacity Limits: Accelerating SMART Manufacturing in the Semiconductor Fab

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FREE WEBINAR: Beyond Sealing: Extrusion And Co-Extrusion For Thermal, Electrical, And Sensing Applications

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    On September 15th at 12:30pm EDT, Shimizu Mikiharu, Technical Team Member, Fujipoly and Christian Miraglia, Applications Engineering Manager, Fujipoly will present a Free EV Engineering Webinar at the CHARGED Virtual Conference. Beyond Sealing: Extrusion And Co-Extrusion For Thermal, Electrical, And Sensing Applications Extrusion and co-extrusion can provide a cost-effective solution for producing long, continuous, or complex profiles, particularly when the tooling and production costs associated with processes such as molding may not be economically practical. These processes can also integrate multiple functions into a single component, including sealing, thermal management, electrical conductivity, switching, grounding, and sensing. This webinar will introduce the fundamentals of extrusion and co-extrusion, including how these processes are used to manufacture profiles with controlled shapes, dimensions, a...