Embedded Intel Solutions Monthly Report : High-Performance DPI, Medical & Security Apps

Website | News | White Papers | Videos | Events | Blogs | Products | Subscribe | Advertise Embedded Intel® Monthly Report April 2013 TOP STORY Accelerate Deep Packet Inspection with Standard Servers The Intel Platform for Communications Infrastructure offers OEMs and platform developers a powerful alternative to traditional NPU offerings, with resources that will help developers deliver first-to-market solutions while saving time and money.  (more) congatec congatec presents COM Express module with Intel® Celeron® Dual-Core processors for 3rd Generation Intel Ivy Bridge architecture congatec introduces Intel® Celeron ® Dual-Core processors with 3rd Generation Intel® Core™ technology for the conga-TS77 (type 6) and conga-BS77 (type 2) COM Express modules. The modules provide impressive performance and improved energy efficiency at an economical price point. Click here for more Versatile System Design for Medical Video Applications: A Blueprint High-performance engines from Intel’s embedded roadmap, along with powerful graphics cards to capture a variety of medical modality and...  (more) HTML5 Is What's Needed To Rapidly Develop IVI Automotive Apps Is HTML5 the right answer for the rabidconsumer's taste for car tech, while still giving the auto manufacturer the safety and security they're ...  (more) Security Concerns Dominate Smart Energy Discussions Smart energy means many things to many people, but for many of the vendors I talk to, the conversation focuses on security. That's not surprising given that ... read mor  (more) Emerson Network Power A new free white paper describes the key elements of the next-generation communications platform from Intel®, codename Crystal Forest, which enables a single ATCA blade type to perform both control and packet processing functions at very high speed, and the key requirements for an effective system-level implementation. Click here for more FEATURED NEWS & ANALYSIS congatec's entry-level module for COM Express Type 6 with Intel® Atom™ dual-core processors Multicore DevCon 2013: Call for Presentations Dedicated to Developers Using Multicore and Virtualization Technologies Intel Announces Intel® System Studio to Speed Time to Market of Embedded and Mobile Systems AAEON Releases EPC-CV1, a Cost-Effective Ultra-Slim EPIC Board Intel® Atom™ N2600, Bottom Mounted CPU, GPU and Chipset for Efficient Heat Dispersion Axiomtek Launched Low-power Intel® Atom™ Cedarview N2600/N2800 Pico-ITX SBC – PICO831 Multicore Developers Conference May 21-22, 2013 - Santa Clara, CA Resolving the technical aspects and business challenges of designing with multicore processors • Multicore Use in Application Specific Topics • Business Trends and Predictions • Evolutionary Topics • General Multicore Issues Register NOW and SAVE BIG!!! Rugged COM Express® Module with 3rd Generation Intel® Core™ i7 Processor for Small Form Factor Systems FEATURED WHITE PAPERS & VIDEOS Enabling Workload Consolidation on the Next-Generation Communications Platform from Intel®, codename Crystal Forest InfiniBand's The Rage in Small, Deployable HPEC Axiomtek Announces Its High-end Mini ITX Motherboard Featuring 3rd Generation Intel® Core™ Processors– MANO873 Axiomtek eBOX730-860-FL - Intel® Core™ i Fanless Embedded System Packs a Punch with Boosting Graphics & Computing Performance, 8 Isolated COM, Triple Display Interfaces and Many More Advantages Portwell's New Type 10 Nano Com Express Module Offers Low Power Consumption in Tight Spaces Intel Accelerates the Data Center and Telecom Network Transformation with New Reference Architectures Axiomtek eBOX530-830-FL - Palm-sized Intel® Atom™ Fanless Embedded System Targets for Space-limited and Mobile Applications Intel® Approves LGX NC200 Industrial NUC Case Sensors Expo & Conference As a subscriber, we'd like to extend a special invitation for you to attend Sensors Expo & Conference, taking place this June 5-6 at the Donald E. Stephens Convention Center in Rosemont, IL. register, use code:A314L at www.sensorsexpo.com for special discounted offers. ARTICLES AND TECH BRIEFS Needed: Self-Protecting, Security-Aware Mobile Applications with Anti-Tamper Technology Application providers need to step up and begin building in sufficient security for mobile devices, including vulnerability mitigation, re-evaluation of trust and incorporation of secure authentication channels. (more) Enabling Accurate Glucose Measurement Designing a glucose monitoring device is made easy with an 8-bit, 8051-based Programmable SoC When you go to your local pharmacy, you’ll find glucose measurement strips that, when plugged into (more) The Expanding Threat Landscape of Connected Medical Devices The medical device industry is in the earliest stages of addressing medical device security today, but developers should expect to see many changes over the next several years. (more) Embedded Moves Towards Intelligent Systems Intel launches initiatives to help customers. (more) Intel-Altera Deal to Shake Up Foundry Landscape But does Intel have the staying power? (more) Analyzing Ultra-Low Power Microcontroller Efficiency Following the microcontroller datasheet specs for energy or power measurements may lead to disastrous conclusions. (more) Flexible Yogurt-Lid Electronics Become a Reality Truly flexible electronics from processor, memory, interface, and battery components are here, thanks to IBM, STMicro, Leti, Imec, Kaist, Kovio, and others. (more) Internet-of-Things (IoT) Advances Home Healthcare for Seniors Open, modular systems deploy quickly and improve monitoring and security. Advancements in embedded information and communication technologies present enormous potential for the intensified healthcare (more) M2M Promises Growth for Embedded, Wireless, Sensors, and More The machine-to-machine (M2M) phenomenon is accelerating and is coming to just about any connected technology near you. Chris Ciufo, Senior Editor Similar to many tech buzzwords before (more) Why M2M Communication Will Remain Heterogenous and How Networks Will Support It All that M2M chatter will mostly be over legacy comms links that require smart gateways for Internet interoperability. (more) Deep Inside Intel Semiconductor Manufacturing & Design sat down with Mark Bohr, senior fellow at Intel, to talk about a wide range of manufacturing and design issues Intel is wrestling with at advanced nodes—and (more) The Secret to Overcoming the Challenges of Intelligent Transportation Systems Design With so many constraints in creating and certifying ITS systems, the secret to success is targeting an optimal solution based upon one of the many small form factor standards. (more) Tizen OS for Smartphones – Intel's Biggest Bet Yet Figure 1: Intel and the Linux Foundation collaborated on Tizen, an open source HTML5-based platform for smartphones, IVI, and other embedded devices. Samsung hedges Apple, Google bets with Intel’s (more) conga-TS77 Highest Performance COM Express® Type 6 3rd Generation Intel® Core™ processor-based platform Better transcode HD-HD, HD Video Conferencing Improved Graphics Performance, (more) NEXCOM EBC 310X 3.5" Embedded Board Designed for Harsh Environments NEXCOM's 3.5" board, the EBC 310X, upgrades to support operating temperatures ranging from -40°C to 85°C, and comes with conformal coating for added protection. With a sleek profile of 146mm (more) FROM THE BLOGOSPHERE Supply Chains, Big Data, and Point-of-Sale for EDA and IP These issues were addressed by supply-chain, product-lifecycle-management, board-design, and chip-design services companies. … AMD's Single Chip Embedded SoC: Upward and to the Right Know what? PCs are in the tank right now, embedded is the market, and AMD might just be better positioned than Intel. They're certainly saying all the right things. Take this week's DESIGN West announcement of the new embedded G Series "SoCs". Two years ago AMD invented the term Accelerated Processing Unit (APU) as a differentiated x86 CPU with an ATI GPU. Continue reading → … Uncertainty Ahead FinFETs hold huge promise, but they also raise some questions for SoC makers that haven't been answered. … MORE FROM THE BLOGOSPHERE EMBEDDED INTEL® PRODUCT BRIEFS Introducing 3rd Generation Intel® Core™ i3/i5/i7 Processor and Low Power Dual Core Intel® Atom™ Processor-Based Solutions (IEI Technology USA Corp.) Rugged COM Express® Module with 3rd Generation Intel® Core™ i7 Processor for Small Form Factor Systems (Extreme Engineering Solutions, Inc.) ADLQM67PC - Industry's Only PC/104 2nd Gen Intel® Core™ Quad Platform! (ADL Embedded Solutions Inc.) 3rd Gen Mini-ITX Motherboard with Intel® Q77 Express Chipset – MANO872 (AXIOMTEK) Low-Power Intel® Atom™ Processor N2600/N2800-Based Pico-ITX SBC – PICO831 (AXIOMTEK) EC800 Series Palm-Size Fanless Embedded System for In-Vehicle Application (DFI-ITOX, LLC) ATCA-7370 Dual Intel® Processor-based Xeon® ATCA® server blade (Emerson Embedded Computing) ATCA-7470 Dual Intel® Xeon® Processor-based 40G ATCA® packet processing blade (Emerson Embedded Computing) ADD YOUR PRODUCT/SERVICE EECatalog provides in-depth coverage of the industry's most important platforms, technologies and applications. Sign up today for your FREE subscription to EECatalog Engineers' Guides and email newletters – including full online access to www.eecatalog.com. WHITE PAPERS Enabling Workload Consolidation on the Next-Generation Communications Platform from Intel®, codename Crystal Forest more white papers VIDEOS InfiniBand's The Rage in Small, Deployable HPEC more videos UPCOMING EVENTS Design West San Jose, CA April 22-25, 2013 RTECC Real-Time and Embedded Computing Conference Nashua, NH May 7th, 2013 Multicore Developers Conference Hyatt Santa Clara, California May 21 - 22, 2013 LTE World Summit Amsterdam, Netherlands 24-26 June 2013 more events Interested in showcasing your hardware, software or services in these issues? Contact Clair Bright, Publisher @ cbright@extensionmedia.com Click Here to Unsubscribe Manage Your Preferences

1786 18th St. | San Francisco, CA 94107 US