Ultra Soft TIM Delivers Low Thermal Resistance





Putty-Like TIM Exhibits Low Compression Force on Delicate Board Components
Sarcon® PG25A is one of Fujipoly's softest and best performing thermal gap filler pads for applications that have delicate components and high compression rates. This compliant material fills any air gaps or uneven mating surfaces between components of varying shapes and sizes while exhibiting a low thermal resistance.
·  Therm. conductivity: 2.5 W/m°K
·  Therm. resistance: 0.42°Cin2/W @ 14.5psi
·  Operating temperature: -40°C to 150°C
·  Thickness: 1.0 to 5.0 mm
·  Available in sheets to 300mm x 200mm
·  Can also be die-cut to your specs

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