Applied Materials breakthrough in electron beam imaging technology; Cadence wins six 2022 TSMC OIP Partner of the Year awards

 

www.semiconductordigest.com December 27, 2022

Top Stories Applied Materials breakthrough in electron beam imaging technology accelerates development of the world’s most advanced computer chips Applied Materials, Inc. announced the commercial availability of “cold field emission” (CFE) technology, a breakthough in eBeam imaging that enables customers to better detect and image nanometer-scale, buried defects to speed the development and production of next-generation Gate-All-Around (GAA) logic chips as well as higher-density DRAM and 3D NAND memories. More>> Share Tweet Share Forward Congratulations to the 2022 recipients of the GSA’s prestigious annual awards The Global Semiconductor Alliance (GSA) celebrated the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala. More>> Share Tweet Share Forward Register Now for SEMICON Japan – Dec. 14-16, 2022 SEMICON Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently, bringing together top players in the semiconductor packaging and PCB mounting fields. Register now. Tech News Toshiba develops SiC MOSFET with embedded Schottky barrier diode that delivers low on-resistance and high reliability Toshiba Electronic Devices & Storage Corporation and Toshiba Corporation have developed an SiC metal oxide semiconductor field effect transistor (MOSFET) that arranges embedded Schottky barrier diodes (SBD) in a check pattern (check-pattern embedded SBD) to realize both low on-resistance and high reliability. More>> Share Tweet Share Forward NCKU researchers “weave single-crystal thin films” to fabricate twisted epitaxial later homostructures A team of researchers led by Prof. Jan-Chi Yang from National Cheng Kung University described how inserting a freestanding oxide layer assisted the generic approach for synthesizing epitaxial twisted oxide lateral homostructures. More>> Share Tweet Share Forward Researchers develop all-optical approach to pumping chip-based nanolasers New technology could aid in meeting the ever-growing need to move more data faster. More>> Share Tweet Share Forward Business News Arizona State University to advance proposal for CHIPS and Science Act funding ASU will offer regionally collaborative proposal to advance microelectronics research, development and manufacturing in Arizona and southwest region as part of national network. More>> Share Tweet Share Forward Cadence wins six 2022 TSMC OIP Partner of the Year awards Cadence Design Systems, Inc. announced that it has won six Open Innovation Platform (OIP) Partner of the Year awards from TSMC for its EDA, IP and cloud solutions. More>> Share Tweet Share Forward Keysight joins Intel Foundry Services Accelerate EDA Alliance program Keysight Technologies, Inc., a technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that it has joined the Intel Foundry Services (IFS) Accelerator Electronic Design Automation (EDA) Alliance program. More>> Share Tweet Share Forward Webinars and Technology Papers Faster Processes and Tighter Control with a High-Speed Liquid Flow Control Designed for CVD and ALD Applications View on Demand Why a Collaborative Open Platform is the Future of Semiconductor Software View on Demand The ULP HYPERRAM™ Enrich MCU Eco-system View on Demand How Dynamic Force Measurement is Driving the Semiconductor Ecosystem Ahead View on Demand A New Spin on Spatial ALD Metrology Solutions View on Demand View Paper Optimize Wafer Quality and Yield with Real-time Data During the CMP Process View on Demand Semiconductor Industry Sustainability: Where Do I Begin, and What Should I Expect? View Paper Using Piezoelectric Sensors to Measure Dynamic Force in Semiconductor Applications View Paper Not All Greenhouse Gases Are the Same - Biggest Benefits Come From Ranking Greenhouse Gas Reduction Impact View Paper MSP — PID Tuning Liquid Flow Controllers (LFCs) for Fast Response & Stabilization Time View Paper When OES is in the Dark: New Metrology Solutions for Advanced ALD, Chamber Management and Sub FAB Safety and Sustainability Applications View on Demand   Web Editor Shannon Davis 603-547-5309 sdavis@semiconductordigest.com  Subscription Information Subscribe to our other newsletters Forward to a colleague or a friend.   To contact us, click here. Top Stories Share Tweet Share Forward Share Tweet Share Forward Share Tweet Share Forward Power transistors to hit another sales record after growth bubble ends Following two years of shortages, strong unit demand, and higher prices, the power transistor market will ease back from double-digit increases to more-normal growth in 2019, says new O-S-D Report. More>>   Tech News Share Tweet Share Forward Share Tweet Share Forward Share Tweet Share Forward FEATURED PRODUCT   Magnetically Levitated Turbopumps The Pfeiffer Vacuum ATH 2804 M/MT and ATH 3204 MMT magnetically levitated turbopumpos are designed for harsh semiconductor applications. They offer a gas throughput of over 5,000 sccm of nitrogen for non-heated applications and up to 1,500 sccm of argon at 65°C in corrosive applications. To prevent by-product deposition, the MT model can be heated and regulated up to 85°C.  Learn more. Featured Video Marposs: Bringing New Solutions to Inspection, Measurement and Monitoring Business News Share Tweet Share Forward Share Tweet Share Forward Share Tweet Share Forward Share Tweet Share Forward Webinars and Technology Papers Faster Processes and Tighter Control with a High-Speed Liquid Flow Control Designed for CVD and ALD Applications View on Demand Why a Collaborative Open Platform is the Future of Semiconductor Software View on Demand The ULP HYPERRAM™ Enrich MCU Eco-system View on Demand How Dynamic Force Measurement is Driving the Semiconductor Ecosystem Ahead View on Demand A New Spin on Spatial ALD Metrology Solutions View on Demand View Paper Optimize Wafer Quality and Yield with Real-time Data During the CMP Process View on Demand Semiconductor Industry Sustainability: Where Do I Begin, and What Should I Expect? View Paper Using Piezoelectric Sensors to Measure Dynamic Force in Semiconductor Applications View Paper Not All Greenhouse Gases Are the Same - Biggest Benefits Come From Ranking Greenhouse Gas Reduction Impact View Paper MSP — PID Tuning Liquid Flow Controllers (LFCs) for Fast Response & Stabilization Time View Paper When OES is in the Dark: New Metrology Solutions for Advanced ALD, Chamber Management and Sub FAB Safety and Sustainability Applications View on Demand

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