Low Temperature Heat Curing Adhesive Systems

 


Master Bond Inc.



Low Temperature Heat Curing Adhesive Systems

 

 

 


Heat Curing Epoxies

Low temperature heat curing one part epoxy systems are formulated to cure at temperatures from 175 to 210°F (80° to 100°C). These systems are well suited for bonding heat sensitive substrates and engineered to fit other application requirements.
    Low temperature heat curing systems are ideal for:
  • Bonding similar/dissimilar substrates with CTE differences
  • Minimizing thermal stress
  • Preventing warpage, cracking during temperature fluctuations




Top Performing Low Temperature Heat Curing Compounds

 

 

 

Master Bond Product EP21LSCL-2

EP21LSCL-2

Non-yellowing, low viscosity, two component epoxy

Request a Technical Datasheet


Master Bond Product UV22DC80-1Med

UV22DC80-1Med

Medical grade adhesive uses UV light and heat for curing

Request a Technical Datasheet


Master Bond Product EP29LPAOHT

EP29LPAOHT

Epoxy for large potting applications features low exotherm

Request a Technical Datasheet


Master Bond Product EP4TC-80

EP4TC-80

High strength epoxy paste can be applied in very thin sections

Request a Technical Datasheet


Master Bond Product Supreme 3CCM-85

Supreme 3CCM-85

Toughened epoxy for glob topping and small encapsulations

Request a Technical Datasheet


Master Bond Product EP5G-80

EP5G-80

Graphite filled NASA low outgassing certified epoxy

Request a Technical Datasheet



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Master Bond Inc. | www.masterbond.com | newsletters@masterbond.com | +1.201.343.8983
154 Hobart Street, Hackensack, New Jersey 07601 USA

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