Applying Visual Data Science and AI to Solve Complex Manufacturing Challenges
Spotfire’s immersive analytics experience aligns with natural human
interactions, offering features like AI- powered recommendations,
real-time data integration, and intuitive visual manipulation.
Introducing 2D-material Based Devices in the Logic Scaling Roadmap
By César Javier Lockhart de la Rosa and Gouri Sankar Kar, imec
A path from planar 2D-FETs to high-performance 2D-CFETs.
A Novel New Approach to Acoustic Inspection using SpinSAM Technology
By Bryan Schackmuth, Product Line Manager at Nordson Test & Inspection
A look at how some of the latest acoustic inspection technology
developments and the continued use of AI are addressing the exacting
quality control needs of manufacturers.
APC-SM Sees Digital Twin Opportunities
By David Lammers, Contributing Writer
Three groups vying to lead Chips Manufacturing USA institute focused on digital twins.
The Time is Now to Push Technology Boundaries
David Smiljanich, SSOE Group
By addressing contract terms and team member adoption of new technology,
industrial leaders optimize both elements, maximizing the potential for
collective project success.
Non-Profit Alliances Boost Chips in Canada
By David Lammers, Contributing Writer
Government aid is forthcoming, but new immigration rules restrict talent.
Enabling HBM 16H Stacks with Residue-Free Fluxless Active Oxide Removal
By Nelson Fan and Greg Clemons, ASMPT
Using a plasma-based approach, active oxide removal technology
empowers 3D chiplet integration and the HBM devices with fine bump pitch
roadmaps and new package architectures. Residue-free fluxless bonding
is ready for prime time.
Modeling Techniques to Speed up Simulation and Emulation in Complex Mixed Signal Devices
By Rohit Bhan, Renesas Electronics America and Vatche Souvalian, Cadence Design Systems.
A new technique yielded a much better filter response, where the current
to charge information was well preserved and also reduced filter
complexity. This solution leads to less computations and events for the
simulator to process, in turn speeding up the simulation.
How LTE-M Outperforms Other Technologies in Asset Tracking
By Dana Cohen, Product Marketing Manager at Sony Semiconductor Israel
The choice of connectivity technology plays a decisive role in the success of tracking assets anywhere in the world.
Leveraging Agile Practices in Chip Design for Enhanced Compliance and Reliability
By Davar Azarmi, Senior Consultant, Highberg
Implementing practices inspired by Agile way or working into chip design
processes offers substantial benefits in enhancing compliance and
reliability.
2025 Outlook: Executive Viewpoints
Each year, Semiconductor Digest turns to industry leaders and analysts
to get their viewpoints on what they expect to see in the coming year in
terms of critical tech and business trends. Hot topics continue to be
supply chain concerns, the impact of the CHIPS Act, the role of
Artificial Intelligence, advanced packaging, 3D integration and
chiplets.
Damping Within Vacuum for Front-end Semiconductor Processes
By Kevin Kaufenburg, Semiconductor Business Development Specialist, Trelleborg Sealing Solutions
Due to the challenges created by vibrations from nearby equipment,
conversations or foot traffic, damping in e-beam systems and other
front-end machines is critical.
Foundries in Europe 2024
By Pierre Cambou, MSc, MBA, is Principal Analyst, Global Semiconductors at Yole Group
European foundry capacity is expected to grow 20% by 2029, just enough to maintain the current capacity share.
Simplifying Technical Documentation for Embedded Systems
By Daniel Hensley, Co-Founder and CTO, Driver
By treating documentation generation as a compilation problem and
leveraging the power of LLMs within a structured framework, a system can
be created to handle the scale and complexity of modern codebases while
producing high-quality, consistent, and maintainable documentation.
The High Tech Used to Upskill a High-Tech Workforce
Bill DeVries, Vice President of Industry Transformation and Customer Success, Dassault Systèmes
Simulation techniques have emerged as an attractive way to train the
next generation semiconductor workforce, meaning robust training can
take place all from a laptop or mobile device.
Regards,
