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Accelerate Failure Analysis of Heterogeneously Integrated Packages with AI-Powered Correlative Microscopy
By Yu-Jen Chang, Cheng-Hsin Liu, Yi-Sheng Lin, Advanced Semiconductor Engineering, and Allen Gu, ZEISS Microscopy
A three-step physical failure analysis process dedicated to analyzing
fine structures and defects in hybrid bonding and FOWLP packages
demonstrates high accuracy and precision, while AI-powered
reconstruction accelerates the speed of 3D X-ray scans.
Spectroscopy for Advanced Semiconductor Material Characterization
By Dr. Praveena Manimunda, Applications Scientist II, HORIBA Scientific
Employing non-destructive techniques such as Raman spectroscopy,
photoluminescence (PL) spectroscopy, and spectroscopic ellipsometry,
researchers have gained unprecedented insights into quantum confinement
effects, defect states, and optical properties — all critical for the
development of next-generation electronics, optoelectronics, and quantum computing.
Asymmetric Power Biasing for Critical Plasma Semiconductor Processes
By Yegor Y. Samoilenko, PhD, Senior Engineer, Advanced Energy
Industries Inc., Thomas G. Jenkins, PhD, Senior Scientist, Tech-X Corp.
and Denis M. Shaw, PhD, Technical Fellow, Advanced Energy Industries
Inc.
Asymmetric bias power is replacing traditional RF bias power in critical
semiconductor processes due to its ability to provide tailored ion
energy distributions (IEDs) to the wafer surface. A particle-in-cell
model compares IEDs from different bias waveforms. Results show that RF
and pulsed DC IEDs vary significantly.
SiC and GaN: The Superior Alternatives Powering Our Energy-Efficient Future
By Deepak Anandan, Process Lead, Orbit & Skyline
SiC and GaN deliver exceptional performance in demanding applications
such as inverters, battery charging systems, and DC-DC converters,
offering minimal energy loss and enhanced heat dissipation.
A Sustainable Future Relies on Flexible Manufacturing Adoption
By Hermann Reiter, Senior Director, Supplier Business Development at DigiKey
Governments, businesses and individuals must work together to drive
innovation and accelerate the transition to a low-carbon economy.
From Manual to Automation: An Agentic AI Approach to Interpreting SECS/GEM Specifications
By Jim Redman, President, Ergotech
Agentic AI offers a new way to think about AI in manufacturing. Instead
of asking what the AI can "analyze," we start asking what problems it
can help "solve."
Spectroscopy for Advanced Semiconductor Material Characterization
By Dr. Praveena Manimunda, Applications Scientist II, HORIBA Scientific
Employing non-destructive techniques such as Raman spectroscopy,
photoluminescence (PL) spectroscopy, and spectroscopic ellipsometry,
researchers have gained unprecedented insights into quantum confinement
effects, defect states, and optical properties — all critical for the
development of next-generation electronics, optoelectronics, and quantum
computing.
Why IoT Must Prepare Now for Quantum Threats
By Avishay Shraga, Sr. Director (CTO), Head of Security Technologies at Sony Semiconductor Israel
Today’s challenges suggest that – at this time – the best approach may
be to begin developing products that are upgrade ready and support
crypto agility. They should minimize investment in future cryptographic
methods, while ensuring that their hardware and software have the
memory, throughput power, and performance capabilities to support future
methods.
Global Challenges in the Semiconductor Supply Chain: Effective Strategies for Resilience
By Graham Scott, Vice President of Global Procurement at Jabil
Navigating semiconductor complexities requires agility and
forward-thinking. Unexpected swings in demand or geopolitical challenges
can disrupt production schedules and inventory levels. To mitigate
these risks and maintain operational continuity, manufacturers need to
build resilience into their strategies.
Nvidia-GM Partnership: Driving the Future of Autonomous Vehicles and Beyond
By Sayan Mitra, Professor of Electrical and Computer Engineering at the University of Illinois’ Grainger College of Engineering
General Motors (GM) and NVIDIA have announced a partnership to
accelerate autonomous driving, advanced driver assist systems (ADAS),
and factory automation. GM, the largest U.S. automaker with a 17% market
share, will integrate Nvidia’s AI chips and Drive software platform
into its next-generation electric and autonomous vehicles.
Lessons Learned from the Pandemic Help Mitigate Today’s Tariffs and Navigate Uncertainty
By Tim Carroll, vice president, digital business at DigiKey
It’s critical for suppliers to ensure their products are non-tariffed
whenever possible and available for shipment, particularly in today’s
fast-paced and highly competitive global market.
What Do Trump’s Tariffs Mean for the European Semiconductor Industry?
By Puneet Saxena, Corporate Vice President, Manufacturing Industry Strategy, Blue Yonder
For European technology businesses reliant on semiconductor supply
chains, the extreme volatility of the geopolitical landscape, compounded
by the ongoing Ukraine war and escalating trade tensions, makes
strategic planning extremely difficult. That’s not to say there aren’t
any options – the problem is, there is no ideal solution.
Agentic AI is the New Yield Engineer
By Alex Joseph Varghese
The fabs that embed agents into dispatch, control, and maintenance loops will define the new benchmark for cost-per-good-die.
Regards,
Pete Singer, Editor-in-Chief
Semiconductor Digest
www.semiconductordigest.com
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